Integrated Eco-Thermal Management (IETM) for Aerospace and Ground Applications

Beltran, Inc. has developed the (IETM) Integrated Thermal Management System for all aerospace missile, carriers, bounds processes of generation and dissipation, transfer and conversion of power, refrigeration, and of bio-metabolism related substances. Local ecosystem of the carrier combines technological and biological subsystems, interacting with internal and outer spaces. 

The innovative IETM System performs recovery of waste thermal energy, generation of “free” refrigeration, and recovery of byproducts into safe coolants (ammonia - water). IETM solutions include novel technologies of intensification of the heat transfer and of conversion of the waste resources into refrigeration for extension of cooling capabilities for high heat radars, lasers and microwave generators.

The IETM includes Vacuum-Evaporative Refrigeration (VER) utilizing “free natural” vacuum and waste heat-activated refrigeration circuits. VER generates ~1000 Btu of “free” cold per pound of wastewater or ammonia. The introduced high performance microstructure of compound electrohydrodynamic (EHD) boundary microsystems intensifies nucleate boiling, preventing dry-out. The coils of the microwires adjoin to the boiling surface and form precision microstructure of heat sink with microchannels between the coils and the surface. The microcavities form the active bubbling nucleation sites along the spiral zones of contacts of the microwires and basic surfaces. The fins-microelectrodes develop additional heat transfer surface and evenly distributed spiral zones of the nucleation sites. Like fibers of a fine wick, the electric forces in EHD capillary structures of the microelectrodes retain the liquid and push out generated vapor bubbles from the surface. Good manufacturability and performance of novel MEMS are based on the commercially available devices and materials and standard simple technology “borrowed” from the electrotechnical industry. 

Conversion of waste resources into refrigeration and EHD activation of boiling allow for meeting stringent weight limitations, reliability and consumption of energy. These conceptual approaches provide diversities in refrigeration capabilities for IETM. On board refrigeration, and effective on-site heat acquisition from high heat releasing components are the key closely related problems of Thermal Management of high heat flux electronics, machines and apparatuses. The IETM should meet contradictive requirements and strong limitations in dimensions, consumption of energy and materials and high reliability. It should be compatible to main processes, support proper environmental conditions, and recover the resources of carrier. IETM could be integrated with general power supply, fluid circulation, heat transfer and control subsystems of the objects. 

The intensive efficient heat transfer objectives are removing large amounts of waste heat through a small surface by suppressing the formation of a vapor layer, and preventing the dryout of the surface, and reduction of the dimensions of cooling surfaces. The conceptually new IETM systems differ in their complexity and levels of integration with other systems and environments. 
Testing setup of thermal management system